- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group
Patent holdings for IPC class H01L 25/11
Total number of patents in this class: 750
10-year publication summary
|
45
|
66
|
92
|
108
|
103
|
77
|
40
|
35
|
35
|
17
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
64 |
| Intel Corporation | 45621 |
30 |
| Denso Corporation | 23338 |
24 |
| Samsung Electronics Co., Ltd. | 131630 |
23 |
| Mitsubishi Electric Corporation | 43934 |
22 |
| Fuji Electric Co., Ltd. | 4750 |
20 |
| Micron Technology, Inc. | 24960 |
19 |
| Murata Manufacturing Co., Ltd. | 22355 |
17 |
| Siemens AG | 24990 |
16 |
| Infineon Technologies Americas Corp. | 768 |
16 |
| ABB Schweiz AG | 6321 |
15 |
| Infineon Technologies AG | 8189 |
14 |
| Rohm Co., Ltd. | 5843 |
12 |
| Invensas Corporation | 645 |
12 |
| International Business Machines Corporation | 60644 |
11 |
| Semiconductor Components Industries, L.L.C. | 5345 |
11 |
| Institut VEDECOM | 62 |
10 |
| Sony Corporation | 32931 |
8 |
| NEC Corporation | 32703 |
7 |
| Qualcomm Incorporated | 76576 |
6 |
| Other owners | 393 |